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Area B, 8 floor, Building 1, No 615, Ningqiao Road, Pudong, Shangha

沪ICP备19001881号-1

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About Fintest

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About Fantest Technology - Professional RF Interconnect Solutions

About Fintest Technology

Providing innovative RF interconnect solutions for telecommunications, data communications, industrial, and semiconductor industries

Company Overview

Shanghai Fantest Technology Development Co., Ltd. was established in 2010, with its headquarters in Shanghai. We have sales offices in Chengdu and Wuxi, and a branch in Changzhou. As a leading provider of high-frequency and high-speed solutions in China, we are committed to delivering high-performance RF interconnect products and cutting-edge testing solutions to global clients.

Leveraging deep technical expertise and global vision, Fantest Technology has established a dual-driven business model combining "distribution + R&D". We are strategic partners with over 10 international top-tier brands and innovators in RF testing. Our self-developed testing systems are widely applied in high-tech fields such as optical communications, data centers, semiconductor testing, and radar communications.

Core Business Areas

Semiconductor Testing Solutions

Comprehensive testing solutions from chip design verification to mass production, supporting high-frequency and high-speed signal testing.

  • 110GHz high-frequency testing capability
  • 112Gbps high-speed signal integrity testing
  • Flip Chip/BGA/LGA package testing
  • Wafer-level and chip-level testing solutions

Communications & Data Center Testing

High-performance testing equipment and systems for 5G base stations, satellite communications, and data centers.

  • 5G NR RF performance testing
  • Millimeter wave band testing solutions
  • High-speed data transmission testing
  • Automated test system integration

Industrial Testing Solutions

High-reliability testing solutions for industrial automation, new energy, and smart grid applications.

  • Industrial-grade RF testing
  • Harsh environment simulation testing
  • EMI/EMC testing solutions
  • Industrial standard-compliant equipment

In-house Products & Technical Capabilities

High-Frequency Probe Station
  • DC to 110GHz testing capability
  • Sub-micron positioning accuracy
  • Multi-probe synchronous testing
  • High/low temperature environment testing
  • Fully automated testing process
High-Speed Signal Integrity Test Fixture
  • Supports 112Gbps PAM4 signal testing
  • Low-loss design with minimal signal distortion
  • Multi-channel parallel testing
  • Customizable design
  • Integrated high-frequency connectors
Chip Test Socket
  • Supports multiple package types
  • High-pin-count, high-density design
  • Low insertion loss
  • Long lifespan and high reliability
  • Customizable for various chips
Automated Test System
  • Multi-axis motion control system
  • Machine vision-guided positioning
  • Automatic test data collection and analysis
  • Customizable test processes
  • Multi-device collaborative operation

Core Technical Capabilities

RF & High-Speed Simulation

3D electromagnetic field simulation, signal integrity analysis, and optimization for high-frequency circuits.

Precision Mechanical Design

Sub-micron precision mechanical structures for high-frequency test equipment positioning.

Automated Test Integration

Multi-axis motion control with machine vision for efficient automated testing.

Precision Machining

Metal/plastic precision machining and surface treatment for high-precision components.

Company Achievements

National Hi-Tech Enterprise

Certified for 5 consecutive years

24 Intellectual Properties

Patents and software copyrights

10+ Global Partners

Strategic partnerships with top manufactures

500+ Customers

Global presence

© 2025 Shanghai Fintest Technology Development Co., Ltd. All rights reserved.

Address:B Area 8th floor,No.615 Ninqiao Road, Pudong, Shanghai | Phone: +86-21-68380250 | Email: sales@fin-test.com