
Area B, 8 floor, Building 1, No 615, Ningqiao Road, Pudong, Shangha
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About Fintest
About Fintest Technology
Providing innovative RF interconnect solutions for telecommunications, data communications, industrial, and semiconductor industries
Company Overview
Shanghai Fantest Technology Development Co., Ltd. was established in 2010, with its headquarters in Shanghai. We have sales offices in Chengdu and Wuxi, and a branch in Changzhou. As a leading provider of high-frequency and high-speed solutions in China, we are committed to delivering high-performance RF interconnect products and cutting-edge testing solutions to global clients.
Leveraging deep technical expertise and global vision, Fantest Technology has established a dual-driven business model combining "distribution + R&D". We are strategic partners with over 10 international top-tier brands and innovators in RF testing. Our self-developed testing systems are widely applied in high-tech fields such as optical communications, data centers, semiconductor testing, and radar communications.
Core Business Areas
Semiconductor Testing Solutions
Comprehensive testing solutions from chip design verification to mass production, supporting high-frequency and high-speed signal testing.
- 110GHz high-frequency testing capability
- 112Gbps high-speed signal integrity testing
- Flip Chip/BGA/LGA package testing
- Wafer-level and chip-level testing solutions
Communications & Data Center Testing
High-performance testing equipment and systems for 5G base stations, satellite communications, and data centers.
- 5G NR RF performance testing
- Millimeter wave band testing solutions
- High-speed data transmission testing
- Automated test system integration
Industrial Testing Solutions
High-reliability testing solutions for industrial automation, new energy, and smart grid applications.
- Industrial-grade RF testing
- Harsh environment simulation testing
- EMI/EMC testing solutions
- Industrial standard-compliant equipment
In-house Products & Technical Capabilities
High-Frequency Probe Station
- DC to 110GHz testing capability
- Sub-micron positioning accuracy
- Multi-probe synchronous testing
- High/low temperature environment testing
- Fully automated testing process
High-Speed Signal Integrity Test Fixture
- Supports 112Gbps PAM4 signal testing
- Low-loss design with minimal signal distortion
- Multi-channel parallel testing
- Customizable design
- Integrated high-frequency connectors
Chip Test Socket
- Supports multiple package types
- High-pin-count, high-density design
- Low insertion loss
- Long lifespan and high reliability
- Customizable for various chips
Automated Test System
- Multi-axis motion control system
- Machine vision-guided positioning
- Automatic test data collection and analysis
- Customizable test processes
- Multi-device collaborative operation
Core Technical Capabilities
RF & High-Speed Simulation
3D electromagnetic field simulation, signal integrity analysis, and optimization for high-frequency circuits.
Precision Mechanical Design
Sub-micron precision mechanical structures for high-frequency test equipment positioning.
Automated Test Integration
Multi-axis motion control with machine vision for efficient automated testing.
Precision Machining
Metal/plastic precision machining and surface treatment for high-precision components.
Company Achievements
National Hi-Tech Enterprise
Certified for 5 consecutive years
24 Intellectual Properties
Patents and software copyrights
10+ Global Partners
Strategic partnerships with top manufactures
500+ Customers
Global presence