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Semiconductor
Advanced Testing Solutions for Next-Generation Chip Technologies
FinTest Technology specializes in providing cutting-edge RF and high-speed test solutions tailored for semiconductor design, verification, and production. Our comprehensive portfolio addresses the critical challenges of semiconductor miniaturization, high-frequency performance, and reliability testing.
Semiconductor Design and Verification Market
Advanced RF and High-Speed Test Solutions
Provide DC~325GHz RF probes, 70GHz TDR probes, and 100GHz socket, DC~145GHz RF interconnection solution enabling accurate measurement of RF/mmWave performance and signal integrity for next-generation semiconductor devices.
Precision Test Calibration
Offer professional calibration solutions including TRL/LRL calibration and ISD in-situ de-embedding, ensuring the accuracy and consistency of test data for semiconductor device characterization and validation.
Typical Application Scenarios
- 5G/6G RFIC: mmWave PA/LNA, transceiver modules, beamforming arrays
- High-Speed SerDes: 800G/1.6T data center interconnects, optical transceivers
- AI Accelerators: HBM memory interfaces, high-bandwidth data buses
Semiconductor Manufacturing Market
Test Equipment
Develop high-throughput manual probe station and Sem-automated probe station for semiconductor wafers and packages, supporting RF/mmWave, DC, and digital parametric testing with integrated vision alignment and probe card technology.
Probe Card Solutions
Design and manufacture custom probe cards for wafer-level testing, including RF cantilever probes, and micro-spring probes optimized for advanced semiconductor nodes (7nm, 5nm, 3nm).
Key Technological Advantages
- Ultra-high-density socket design for advanced packaging (Flip Chip, 2.5D/3D)
- High-precision alignment systems with sub-micron accuracy
- Thermal management solutions for high-power device testing
Advanced Packaging and Heterogeneous Integration Market
3D-IC and Heterogeneous Integration Test
Provide test solutions for advanced packaging technologies such as SiP, 2.5D/3D-IC, and Chiplet integration, addressing interposer testing, TSV (Through-Silicon Via) verification, and die-to-die interface validation.
High-Bandwidth Memory (HBM) Testing
Develop specialized test fixtures and systems for HBM modules and interfaces, supporting high-speed data transfer rates up to 8.4Gbps per pin and multi-channel validation.
Emerging Technology Support
- Silicon Photonics: Photonic integrated circuit (PIC) test solutions
- Quantum Computing: Cryogenic RF probe systems for qubit testing
- Advanced Sensors: RF/mmWave sensor validation for automotive and IoT