Area B, 8 floor, Building 1, No 615, Ningqiao Road, Pudong, Shangha
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Telecom and Datacom
High-speed Interconnection and Testing Technologies Drive Digital Infrastructure Upgrades
FinTest Technology specializes in providing full-bandwidth test solutions from DC to 325GHz for telecom carriers, data centers, and communication equipment manufacturers. Our products facilitate the development and deployment of 5G/6G networks, high-speed data center interconnections, computing power center interconnections, and optical communication technologies.
5G/6G Network Equipment Testing Market
Millimeter Wave Testing Solutions
Provide RF probe systems from DC to 325GHz, supporting device and module testing for 5G NR FR2 bands (24.25GHz~52.6GHz) and 6G millimeter wave bands (71GHz~110GHz).
5G Core Network Element Verification
Offer high-speed digital interface testing for gNodeB and CU/DU split architectures, supporting signal integrity testing and protocol verification for CPRI/eCPRI, NGFI, and other interfaces.
Typical Application Scenarios
- 5G Base Stations: Millimeter wave power amplifiers, low-noise amplifiers testing
- Mobile Devices: 5G NR modules, millimeter wave antenna array testing
- Network Equipment: 5G core network elements, fronthaul/ midhaul/ backhaul equipment verification
Data Center High-Speed Interconnect Market
High-Speed SerDes Testing
Provide test solutions for up to 112Gbps PAM4 signals, supporting the R&D and production testing of 800G/1.6T data center switches, network interface cards, and optical modules.
Signal Integrity Analysis
70GHz TDR differential probes and high-speed test fixtures supporting signal integrity analysis and jitter testing for high-speed buses such as PCIe 5.0/6.0/7.0, CXL, and Ethernet.
Key Technical Advantages
- Ultra-low noise probe technology supporting picosecond-level signal measurement
- High-precision TDR measurement with impedance measurement accuracy of ±0.5Ω
- High-speed digital signal eye diagram analysis and jitter decomposition
Optical Communication Market
Optical Module Testing
Provide automated test systems for 400G/800G optical modules, supporting QSFP-DD, OSFP, and other package formats, integrating high-speed electrical and optical interface testing capabilities.
Silicon Photonics Chip Testing
Offer 325GHz ultra-high-frequency test probes for silicon photonics integrated chips, supporting RF characterization of optoelectronic devices and performance verification of optical modulators.
Typical Collaboration Cases
- Leading global communication equipment providers: 400G/800G optical module R&D testing
- Major communication system integrators: 5G fronthaul optical module automated testing
- High-speed optical device manufacturers: High-speed optical communication device performance verification