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2.5D Packaging Large Array Device Testing Socket

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Name: 2.5D Packaging Large Array Device Testing SocketDescription:

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2.5D Packaging Large Array Device Testing Socket - FinTest Technology

2.5D Packaging Large Array Device Testing Socket

Breaking through 13,000+ pin testing bottlenecks, empowering high-performance computing chip R&D and production testing

Product Basic Information

Product Model

P/N FTS 0000120A

Application Scenarios

Designed for semiconductor Chiplet advanced packaging, CPO co-packaging, and 2.5D/3D integrated devices

Core Integrated Functions

High-precision testing socket integrating temperature control, pressure sensing & control, and high-frequency performance

Product Gallery

Core Technical Features

1. Precise Temperature Control: TEC + Water Cooling Dual Protection

  • Integrated TEC temperature control module: Supports -40°C to +150°C wide temperature testing with ±0.1°C control accuracy, ensuring performance verification of optical chips and SerDes signals in extreme environments
  • Industrial chiller expansion: Single unit supports parallel connection of two fixtures, with stable and efficient water cooling system to eliminate temperature drift during testing

2. Innovative Structure: Precise Pressure + Safe Operation

  • Real-time dynamic pressure sensing: Monitors pressing pressure (range 5-120kg) and automatically adjusts pressure to ensure devices remain in optimal stress state during testing, improving accuracy and reliability
  • Dual buckle foolproof design: Opening pressure ≤5kg for safe and convenient operation; modular design adapts to automated production line requirements

3. Extreme Performance: High-Density Pins + High-Frequency Signal Assurance

  • Large array adaptation: Through carefully designed limit frames and pin boards, achieves precise positioning and connection of 13,000+ pin complex arrays, ensuring efficient and accurate electrical connections
  • High signal integrity: Supports high-speed signal testing such as D2D/SerDes with insertion loss <1dB@53GHz and crosstalk suppression >40dB, ensuring chip signal integrity verification

4. Industrial-Grade Reliability: Durable Materials + Leak-Proof Design

  • Military-grade materials: Base uses 6061 alloy, probe board uses high-strength engineering plastic, wear-resistant with pressing life exceeding 500,000 cycles
  • Leak-proof design: Fully sealed water pipe and cable interfaces, passing 48-hour continuous pressure test with no leakage risk

Product Customization & Consultation

For customized Socket products or detailed technical information, please contact us through the following channels:

Inquiry Hotline: +86 21 6838 0250
Business Email: sales@fin-test.com
Official Website: www.fin-test.com

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