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2.5D Packaging Large Array Device Testing Socket
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                         Name: 2.5D Packaging Large Array Device Testing SocketDescription:
                            	Name: 2.5D Packaging Large Array Device Testing SocketDescription: 
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2.5D Packaging Large Array Device Testing Socket
Breaking through 13,000+ pin testing bottlenecks, empowering high-performance computing chip R&D and production testing
Product Basic Information
Product Model
P/N FTS 0000120A
Application Scenarios
Designed for semiconductor Chiplet advanced packaging, CPO co-packaging, and 2.5D/3D integrated devices
Core Integrated Functions
High-precision testing socket integrating temperature control, pressure sensing & control, and high-frequency performance
Product Gallery
 
 
			
				Overall Product Appearance
			
		 
 
			
				Precision Pin Array Details
			
		 
 
			
				Working Status Demonstration
			
		Core Technical Features
1. Precise Temperature Control: TEC + Water Cooling Dual Protection
- Integrated TEC temperature control module: Supports -40°C to +150°C wide temperature testing with ±0.1°C control accuracy, ensuring performance verification of optical chips and SerDes signals in extreme environments
- Industrial chiller expansion: Single unit supports parallel connection of two fixtures, with stable and efficient water cooling system to eliminate temperature drift during testing
2. Innovative Structure: Precise Pressure + Safe Operation
- Real-time dynamic pressure sensing: Monitors pressing pressure (range 5-120kg) and automatically adjusts pressure to ensure devices remain in optimal stress state during testing, improving accuracy and reliability
- Dual buckle foolproof design: Opening pressure ≤5kg for safe and convenient operation; modular design adapts to automated production line requirements
3. Extreme Performance: High-Density Pins + High-Frequency Signal Assurance
- Large array adaptation: Through carefully designed limit frames and pin boards, achieves precise positioning and connection of 13,000+ pin complex arrays, ensuring efficient and accurate electrical connections
- High signal integrity: Supports high-speed signal testing such as D2D/SerDes with insertion loss <1dB@53GHz and crosstalk suppression >40dB, ensuring chip signal integrity verification
4. Industrial-Grade Reliability: Durable Materials + Leak-Proof Design
- Military-grade materials: Base uses 6061 alloy, probe board uses high-strength engineering plastic, wear-resistant with pressing life exceeding 500,000 cycles
- Leak-proof design: Fully sealed water pipe and cable interfaces, passing 48-hour continuous pressure test with no leakage risk
Product Customization & Consultation
For customized Socket products or detailed technical information, please contact us through the following channels:
			 Inquiry Hotline: +86 21 6838 0250 
		
		
			 Business Email: sales@fin-test.com 
		
		
			 Official Website: www.fin-test.com 
		
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