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3.2T CPO Test Socket
Name: 3.2T CPO Test SocketDescription: Against the backdrop of the popularization of 3.2T CPO (Co-packaged Optics) high-speed interconnection technology, the precision and reliability of testing for high-end optical communication chips and components directly determine the transmission efficiency of data centers and supercomputing centers. Leveraging years of R&D experience in precision test devices, FinTest Technology launches the FTS0170-BGA550-29.8X24-.6P Test Socket, specially designed for 3.2T CPO packaged devices. With 551 high-precision probes and micron-level tolerance control as its core, it provides a stable and accurate solution for testing core components of 3.2T CPO.
- Outline
- Application
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Product Overview
Against the backdrop of the popularization of 3.2T CPO (Co-packaged Optics) high-speed interconnection technology, the precision and reliability of testing for high-end optical communication chips and components directly determine the transmission efficiency of data centers and supercomputing centers. Leveraging years of R&D experience in precision test devices, FinTest Technology launches the FTS0170-BGA550-29.8X24-.6P Test Socket, specially designed for 3.2T CPO packaged devices. With 551 high-precision probes and micron-level tolerance control as its core, it provides a stable and accurate solution for testing core components of 3.2T CPO.
This test socket is adapted to a core test area size of 29.8×24mm with a pin pitch of 0.6mm, compatible with multi-scenario installation requirements of 3.2T CPO. It balances structural strength and test stability, meeting the high-reliability testing needs of supercomputing centers, intelligent computing data centers, high-end optical communication equipment and other fields, helping customers improve the yield and testing efficiency of 3.2T CPO products.
Core Features
1. High-Precision Probes with 551 Pins Pressure for Accurate Contact
Adopting BeCu (Beryllium Copper) material probes, the single pin pressure is precisely controlled at 20gf to ensure stable contact between each probe and the pins of 3.2T CPO devices, avoiding test errors caused by poor contact. The 551 probes fully cover the pins of BGA550 package, meeting the testing requirements of 3.2T CPO devices with high pin count.
2. Core Dimension of 29.8×24mm with 0.6P Pitch for Precision Adaptation
- Dimension Adaptation: Core test area size of 29.8×24mm with 0.6mm pin pitch (.6P), accurately matching the BGA550 package layout of 3.2T CPO and compatible with lidded component testing scenarios.
- Tolerance Control: Core dimension tolerance is controlled at ±0.02mm (two decimal places in millimeters), and angle tolerance at ±0.15°, ensuring precise positioning accuracy for 3.2T CPO device testing to meet stringent testing requirements.
3. Multi-Material Combination for Strength and Durability
- The main structure is made of AL6061 aluminum alloy (sandblasted black anodized), balancing lightweight design and structural strength, wear-resistant and corrosion-resistant, suitable for high-frequency testing scenarios of 3.2T CPO.
- The pin plate is made of brass with gold plating, reducing contact resistance, improving conductivity and service life, and ensuring the accuracy of 3.2T CPO high-speed signal transmission testing.
- Standard components are made of 304/SUS304 stainless steel, suitable for various industrial environments, avoiding oxidation failure and meeting the long-term testing needs of 3.2T CPO.
4. Flexible Installation Design for Multi-Scenario Application of 3.2T CPO
Supports two installation methods: 4 through-hole installation on System Load Board (SLT) (adapted to M2.0 national standard screws) and 4 plated pad installation on ATE Load Board (adapted to M2.0 PEM nuts). The installation area features no solder mask design to ensure installation flatness, adapting to different test platform requirements of 3.2T CPO.
5. Integrated Heat Dissipation Design for High-Power 3.2T CPO Device Testing
Built-in 40×40×28mm 12V cooling fan to efficiently dissipate heat generated by high-power 3.2T CPO devices, supporting testing of devices with a maximum component height of 32MM. It eliminates performance drift of 3.2T CPO devices caused by high temperature, ensuring the accuracy of test data.
Core Technical Parameters
| Item | Specification Parameters |
|---|---|
| Model | FTS0170-BGA550-29.8X24-.6P (Dedicated for 3.2T CPO) |
| Number of Probes / Single Pin Pressure | 551 pcs / 20gf |
| Package Compatibility | BGA550 (0.6mm pin pitch/.6P, adapted to 3.2T CPO) |
| Core Test Area Size | 29.8×24mm (Tolerance ±0.02mm) |
| Maximum Component Height | 32MM (Component Area), 14.0MM (Lid Main Body Area) |
| Heat Dissipation Solution | 40×40×28mm 12V Fan (Adapted to High-Power Heat Dissipation of 3.2T CPO) |
| Installation Method | M2.0/M2.5/M3 Screws (SLT/ATE Dual-Scenario Adaptation for 3.2T CPO Testing) |
| Core Materials | BeCu (Probe), AL6061 (Base), Brass (Pin Plate, Gold-Plated), 304 Stainless Steel (Standard Components) |
| Locating Pin Specification | Φ2.0/Φ1.5 (Positioning Accuracy ±0.04/0.02mm) |
| Electrical Bandwidth | Supports up to 224G PAM4 (Adapted to 3.2T CPO High-Speed Signal Testing) |
| PCB Pad Recommendation | Hard Gold Plating ≥0.0013mm (50 microinches), Nickel Plating ≥0.005mm (200 microinches), Knoop Hardness 130~200 |
Structure Composition and Materials
The FTS0170-BGA550-29.8X24-.6P Test Socket adopts a modular precision design, mainly composed of Socket Assembly, Lid Assembly and heat dissipation system. Core components are made of high-performance materials to ensure the testing stability and service life of 3.2T CPO.
Figure 1: Overall Structure Exploded View of 3.2T CPO Test Socket
Figure 2: Detail Diagram of 3.2T CPO Test Socket Core Materials (BeCu Probe/AL6061 Base)
| Part Number | Name | Material | Surface Treatment | Function Description |
|---|---|---|---|---|
| FTS0170-0001 | Floating Plate | PI | NA | Probe floating compensation to ensure contact consistency of 3.2T CPO devices |
| FTS0170-0002 | Middle Pin Plate | Brass | Gold-Plated | Probe positioning and conductive transmission, adapted to 3.2T CPO high-speed signals |
| FTS0170-0003 | Lower Pin Mold | Brass | Gold-Plated | Probe fixation and bottom conduction, ensuring testing stability of 3.2T CPO |
| F3570DF025A00 | Probe | BeCu | NA | Core contact component, signal acquisition for 3.2T CPO device pins |
| FT90170-0011 | Base | AL6061 | Sandblasted Black Anodized | Main structural support, adapted to high-frequency testing scenarios of 3.2T CPO |
| 40X40X28 Fan | Fan | PBT | NA | Heat dissipation component, reducing testing temperature of high-power 3.2T CPO devices |
Standard components include flange nuts, hexagon socket screws, springs, etc., made of 304/SUS304 stainless steel to ensure installation tightness and fatigue resistance. Locating pins adopt Φ2.0/Φ1.5 specifications to ensure precise alignment between the test socket and 3.2T CPO devices. The overall structure balances precision and durability, meeting the high-frequency testing needs of 3.2T CPO.
Application Scenarios
The FTS0170-BGA550-29.8X24-.6P Test Socket is specially designed for testing high-pin-count BGA packaged devices of 3.2T CPO (Co-packaged Optics), and is widely used in R&D verification and mass production testing of core components of 3.2T CPO. Specific scenarios include:
3.2T CPO Optical Chip Testing
Adapted to functional testing and performance verification of BGA550 packaged optical chips for 3.2T CPO, covering core chips in high-speed optical communication, supercomputing centers and other fields.
3.2T CPO Data Center Interconnection Testing
Reliability testing of 3.2T CPO high-speed interconnection components in intelligent computing/supercomputing data centers, ensuring the stability and accuracy of massive data transmission.
3.2T CPO Optical Communication Equipment Testing
Mass production testing of 3.2T CPO core modules in high-end optical communication equipment, meeting the high-reliability testing requirements of telecom grade.
3.2T CPO R&D Phase Debugging
Performance screening and parameter debugging during the R&D process of new 3.2T CPO devices, accelerating the R&D iteration of 3.2T CPO products and reducing mass production risks.
Contact Us
FinTest Technology takes precision manufacturing as its core and provides customized 3.2T CPO testing solutions for you. With high precision and high reliability, the FTS0170-BGA550-29.8X24-.6P Test Socket is a reliable choice for your 3.2T CPO device testing, helping your 3.2T CPO products gain market competitiveness.
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