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QFN 3X3 22GHz LNA Test Fixture

Now: Products > QFN 3X3 22GHz LNA Test Fixture

Name: QFN 3X3 22GHz LNA Test FixtureDescription:

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QFN/CQFN-3X3 0.5mm Pitch: 10~22GHz RF Chip Test Socket - Product Details

QFN/CQFN-3X3 0.5mm Pitch: 10~22GHz LNA Test Fixture

Designed for wideband low-noise RF amplifiers in QFN/CQFN 3×3mm package, supporting high-precision RF testing, wide temperature adaptation, and stable mass production testing.

3×3mm 0.5mm Pitch Compatible 10~22GHz Wideband Low Noise Amplifier RF Test

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Key Features

  • Precise 3×3mm Chip Compatibility

    Perfectly matches 3×3mm RF chips such as PMA3-223GLN+. Pin position, pitch, and height are strictly designed according to chip pads for stable and reliable contact.

  • 10~22GHz Wideband RF Support

    Optimized for wideband low-noise amplifiers, supporting full 10~22GHz signal transmission with low loss, high isolation, and perfect matching for chip RF performance.

  • Flip & Knob Integrated Structure

    Aluminum alloy flip with knob locking structure, easy to operate, uniform pressure, protects the chip surface from damage, suitable for R&D and mass production testing.

  • High Wear-Resistant PCB Design

    Supports hard gold + nickel plated PCB pads, effectively prevents test wear, maintains stable electrical connection for long-term use, and extends service life.

Technical Specifications

Parameter Specification / Description
Part Number FTS0099P-3X3
Compatible Chip Size QFN 3×3mm 0.5mm Pitch
Frequency Range DC~22GHz (Supports 10~22GHz Wideband Chips)
Structure Flip Top + Knob Locking
Main Materials PEEK, TORLON, 6061 Aluminum Alloy, Copper
Probe Material Beryllium Copper (BeCu) Gold Plated
Mounting Screws M2 Standard Screws, 4-hole Positioning
Recommended PCB Plating Hard Gold ≥0.0013mm, Nickel ≥0.005mm
Dimensions 28×28mm (Standard Compact)
Applications ATE Testing, SLT Board Testing, R&D Validation

Core Advantages

1:1 Precision Matching with RF Chips

Designed according to chip pad definitions with precise alignment of pin pitch, position, and height.

Coaxial structure design with low parasitic inductance and high cycle life.

Engineering-Grade Durability & Easy Installation

Sandblasted black anodized aluminum alloy housing for high strength and excellent heat dissipation; internal ceramic/PEEK insulation for superior high-frequency performance.

Standard 4×M2 mounting holes, compatible with ATE load boards and SLT system boards. Flat, burr-free mounting area for quick replacement.

Optimized for Wideband LNA Testing

Perfectly matches testing requirements for 10~22GHz wideband, high-gain, low-noise amplifiers, ensuring accurate measurement of NF, gain, OIP3, P1dB and other key parameters.

Built-in ground pads and thermal design to reduce test interference and improve data consistency.

Typical Applications

  • R&D validation and parameter testing for QFN 3×3mm wideband low-noise amplifiers.
  • Mass production ATE testing for 5G RF front-end, microwave communication, and satellite communication chips.
  • Automated testing of noise figure, gain, and linearity for 10~22GHz high-frequency chips.
  • Chip burn-in and reliability testing under high/low temperature environments in laboratories.
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