For high-speed computing,quantum computing, communications, semiconductor and other markets, the rate of high-speed data transmission and signal integrity is critical and challenge for interconnection solution.Fintest cooperate with world trchnolyg leader to provide the interconnection solution for any high speed digital signal transmitting  requirement. for the massive demand for ever larger data centers and high capacity Internet data switching facilities. To enable the up-scaling of data centers, a new generation of Ethernet communication interfaces providing higher interface capacity, as well as smaller size, lower cost and lower power dissipation are RF analog and mixed signal SiGe and CMOS chip as needed.

 

 

Data Center

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4 Chaneel CDR Chip for 100G/200G/400G optical module,siilicon photnics and AOC application

Intergrated with VCSEL driver

Intergrated with TIA

Quantum Computing

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Fintest Technology provide the interconnection solution and RF device which work well in the cryogenic enviroment.

 

Semiconductor

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Fintest provide the high signal intergrity product for the RF and High Speed Signal testing with the wafer level and packaging level.