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XR1019-QH 34GHz Receiver Chip Test Fixture

Now: Products > XR1019-QH 34GHz Receiver Chip Test Fixture

Name: XR1019-QH 34GHz Receiver Chip Test FixtureDescription:

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FTS0174P: XR1019-QH Receiver Chip Dedicated Test Fixture - Product Details

FTS0174P: XR1019-QH Receiver Chip Dedicated Test Fixture

A high-precision, high-reliability test fixture specifically designed for MACOM's high-performance 27-34 GHz QFN receiver chip XR1019-QH, suitable for R&D verification and mass production testing, ensuring accurate measurement of key RF parameters.

Millimeter Wave Test QFN24 Adaption High Precision Test Stable Structure R&D Verification

Product Core Highlights

  • Integrated Chip Non-Destructive Testing

    Optimized for 4x4 mm 24-pin QFN package, precisely adapting to XR1019-QH's pin layout. Using precision contact technology, it achieves full-feature, non-destructive testing of the internally integrated LNA, mixer, LO multiplier, and buffer amplifier, protecting chip pads.

  • Precise Ka-Band Application Adaption

    Optimized for XR1019-QH's core operating frequency (27.0-34.0 GHz, Ka-band) and 12.5-18.0 GHz LO input, ensuring excellent RF performance across the entire operating band, supporting precise conversion gain and noise figure measurement.

  • Comprehensive Bias and Interface Support

    Provides complete DC bias access points, including VD1/2/3 (3V), VG1/2/3 (-0.35V), VG4 (-3V), and Mixer Bias, and supports IF1/I, IF2/Q differential IF outputs and LO input, meeting all electrical specification test requirements of the chip.

  • High Reliability Design and Protection

    Follows the datasheet's absolute maximum ratings and recommended layout, with built-in ESD protection (HBM Class 1A) ensuring test safety. Robust structure can withstand MSL3 humidity level processes, supporting -55°C to +85°C wide temperature testing.

Core Parameters Overview

The following are the key adaptation parameters and performance indicators of the FTS0174P test fixture, specifically designed to meet the testing requirements of the XR1019-QH chip.

Parameter Category Parameter Value / Description
Compatible Chip Model MACOM XR1019-QH (Integrated LNA, Image-Reject Mixer, LO Multiplier)
Target Package Lead-Free 4 mm 24-lead QFN (PQFN), 4x4 mm body
Core Test Frequency (RF) 27.0 - 34.0 GHz
LO Input Frequency 12.5 - 18.0 GHz
IF Output Frequency DC - 2.0 GHz (Supports I/Q output)
Supported Key Performance Tests Conversion Gain (13 dB typical), Noise Figure (2.5 dB typical), Input Third-Order Intercept (IIP3, -2 dBm typical), Image Rejection (20 dBc typical)
DC Bias Support VD1/2/3: 3V; Id1: 7.5mA, Id2: 30mA, Id3: 90mA; VG4: -3V; Supports active bias circuit connection
Grounding Design Bottom exposed pad and all NC pins reliably grounded, meeting RF and DC grounding requirements
Operating Temperature Range -55°C ~ +85°C (Adapting chip operating temperature)

Core Advantages

The FTS0174P test fixture fully considers the testing complexity of the XR1019-QH as a high-frequency receiver chip, providing the following professional solutions.

Image Rejection Test Solution

The fixture design supports the chip's I and Q mixer outputs and facilitates connection to an external 90-degree hybrid network, accurately selecting and testing the desired upper sideband (USB) or lower sideband (LSB), enabling accurate evaluation of up to 20 dBc typical image rejection performance.

Optimized signal path, strictly controlling isolation between test channels, ensures effective shielding of LO leakage (2xLO to RF isolation typical -25 dB) and other interferences when measuring high-sensitivity noise figure (as low as 2.5 dB), obtaining reliable test results.

Convenient Bridge Between Evaluation and Mass Production

Following the datasheet "Recommended Board Layout," with reserved positions for 0402 (100pF) and 0805 (10uF) decoupling capacitors near bias pins, users can easily reproduce the evaluation board environment, achieving seamless transition from R&D verification to mass production testing.

Robust mechanical structure and high-life contact design can withstand multiple chip placements and removals, meeting repeatability requirements for reliability testing (e.g., MTTF evaluation) and batch production testing. Clear pin markings and foolproof design greatly improve test setup efficiency and accuracy.

Core Application Scenarios

  • R&D characteristic verification and performance optimization of XR1019-QH receiver channels in point-to-point radio equipment
  • High-frequency receiver front-end testing in satellite communications (SATCOM), very small aperture terminals (VSAT), and other telecommunication systems
  • Mass production testing and consistency screening of chip key parameters (conversion gain, noise figure, image rejection, etc.)
  • Evaluation of overall system performance with external components (e.g., 90-degree hybrid network, filters) and chip co-tuning
  • Reliability verification and characteristic analysis of chips over wide temperature range (-55°C to +85°C)
  • In-depth research on Ka-band integrated receiver architecture and performance in educational and research institutions

Technical Support Services

  • Complete Design Documentation Package: Provides detailed PCB footprint drawings, schematic connection references, and Bill of Materials (BOM) compatible with the fixture, helping users quickly integrate FTS0174P into custom test load boards or evaluation systems.
  • Calibration and Verification Kit: Optional calibrated standards and verification chips for establishing test system error models and performing regular calibration, ensuring long-term accuracy and traceability of millimeter-wave band test data.
  • Professional Technical Consultation: Provides expert-level consulting services on XR1019-QH chip testing solutions, bias circuit design (e.g., active bias), and high-frequency PCB layout, assisting customers in solving complex testing challenges.