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67GHz RF Burn-in Test Socket

Now: Products > 67GHz RF Burn-in Test Socket

Name: 67GHz RF Burn-in Test SocketDescription: burn-in socket for BGA packaged millimeter-wave chips, designed for mass production high-temperature endurance aging of RF chips

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67GHz RF Burn-in Test Socket - Product Details

67GHz RF Burn-in Test Socket

Fin-Test dedicated burn-in socket for BGA packaged millimeter-wave chips, designed for mass production high-temperature endurance aging of RF chips

67GHz mmWave For High Temp Burn-in 96PIN BGA Anti Solder Ball Damage Copper Heat Dissipation Full RF Inspection

Product Description

  • Low-Stress Precision Probes

    Single pin pressure ≤30g to avoid extrusion damage to chip solder balls; separated layout for RF, low-frequency and ground pins, featuring high channel isolation, excellent signal integrity and power integrity.

  • High Insulation Withstand Structure

    The pin plate and limit frame adopt high-temperature resistant PEEK insulating material, matched with aluminum alloy housing; withstand voltage ≥100V AC, supporting long-term powered high-temperature aging tests.

  • Uniform Flip Clamping Mechanism

    Built-in plane bearings and multiple sets of stainless steel springs, the knob flip cover slides smoothly with balanced and stable downward pressure, and it is not easy to loosen and fail after tens of thousands of production cycles.

  • Dual PCB Platform Compatibility

    Compatible with two toolings: SLT system board and ATE load board, equipped with standardized M1.6 mounting holes and standardized PCB gold plating process to prevent pad abrasion.

  • High RF Matching DC~67GHz

    Return loss ≥10dB, no RF signal attenuation or drift during long-term aging.

  • Wide-Temperature Copper Cooling System

    Operating temperature range: -50℃ ~ +150℃; the maximum temperature of chip solder balls is ≤140℃ under 110℃ chamber condition.

Spec Overview

RF, Electrical, Mechanical, Thermal & Material Properties

Category Item Name Technical Spec
RF Performance Operating Frequency Range DC ~ 67 GHz
RF Performance RF Return Loss ≥10dB
RF Performance Dielectric Withstand / Insulation Resistance ≥100V AC / ≥200 MΩ
Low-Frequency Electrical Max Current Per Pin 1A per pin
Low-Frequency Electrical Single Pin Contact Resistance ≤100 mΩ
Low-Frequency Electrical Probe Spec Φ0.2mm
Mechanical Properties Single Pin Force ≤30g (Anti-solder ball damage)
Mechanical Properties IC Limit Frame Size 4.91mm (Tolerance 0~+0.03)
Thermal Performance Operating Temperature -50℃ ~ +150℃
Thermal Performance Max Solder Ball Temp @110℃ Chamber ≤140℃

RF Performance Test Charts

Measured data from factory dedicated fixture, intuitively showing full-band RF transmission stability

57~64GHz Return Loss Test Curve

mmWave RF Return Loss Test Chart

Test Key Points: All RF channels reach S11≥10dB across DC~67GHz full band, with excellent RF matching and no signal drift or attenuation distortion during long-term aging.

RF Insertion Loss Test Curve

RF Insertion Loss Test Chart

Test Key Points: Insertion loss of all RF channels is stable and controllable without sharp attenuation, ensuring accurate and reliable test data for millimeter-wave chip aging.

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